Zero ASIC

Democratizing silicon.

3D rendering of an EFabric chip

Composable Chiplets

Zero ASIC is building the world’s first composable chiplet platform, enabling billions of unique silicon systems to be assembled in hours from a catalog of off-the-shelf chiplets.

Standardized chiplets

First demonstration of fully standardized chiplets, supporting O(m^n) system permutations (m=library size, n=substrate sockets).

Smart substrates

Active 3D silicon substrates that decople compute and networking, enabling LEGO like system composition.

World leading energy efficiency

Sub 0.1 pj/bit chiplet communication efficiency.

Design IP Generators

Our platform of scalable processor IP generators enable rapid per application generation of bespoke FPGAs, CPUs, NOCs, and DSPs to meet the most stringent system requirements.

Automated

Push button 100% automated IP generation.

Scalable

Performance scalable from edge to data-center.

Mature

Our IP generators have been used to tape out chips at 65nm, 28nm, 16nm, and 12nm.

Silicon Compiler

To lower the barrier to custom ASICs, Zero ASIC developed SiliconCompiler, an open source hardware compilation platform. The principles behind SiliconCompiler are documented in this 2022 DAC paper.

Battle tested

Silicon proven flows supporting a large set of open source and proprietary EDA tools and PDKs.

24 Hour Tapeout Cycles

Optimized cloud scale build infrastructure enable rapid design cycles.

Deterministic

Standardized manifests and design-as-code approach enable guarantee compilation determinism.

Open source

No lock in or hidden agendas!

Digital Twins

Our Switchboard digital twin platform enables near real-time emulation, allowing teams to optimize the system hardware and software before committing to costly manufacturing cycles. The methodology behind our approach is detailed in this scientific paper.

Fast

Our chiplet optimized digital twin platform enables an order of magnitude faster build and run times compared to leading commercial emulators.

Scalable

Our latency insensitive enable wafer scale designs and beyond.

Flexible

Standardized model interfaces facilitate seamless transitions between high-level models (e.g. QEMU), cycle-accurate RTL simulators (e.g. Verilator), and hardware-in-the-loop systems (e.g. AWS F1 FPGAs).

Reinventing ASIC design

Step 1: Emulate

Use Digital Twin platform to optimize hardware and software.

Step 2: Prototype

Build rapid chiplet based prototypes.

Step 3: Optimize

Optimize chiplet composition based on market feedback.

Step 4: Go To Market

Place a production purchase order and start manufacturing.

Profit!

Highlights from our Blog

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Composable chiplets

Composable chiplets represent a powerful new design approach with the potential of disrupting a large portion of the semiconductor market. This month I will be presenting ideas for how chiplets can be applied to a number of critical applications.

Lowering the Barrier to Chiplets

Chiplets are all the rage these days, even making MIT Technology Review's 10 Breakthrough Technologies of 2024. This is pretty incredible for such a niche technology! Unfortunately, as of today chiplets are only accessible to semiconductor mega-corps. To unlock the true power of disaggregated chiplet innovation, we need to drastically reduce the barriers to chiplet based design.

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