PackageCompiler

PackageCompiler

PackageCompilerTM is a fully autonomous integrated circuit (IC) package compiler that translates specifications into manufacturing-ready layout. PackageCompiler was built around a simple belief: package design and layout should be treated as a software compilation problem, not a manual drafting exercise. By combining a unified 3D data model, automated implementation, and massively parallel optimization, PackageCompiler enables engineers to design complex chiplet systems with a level of productivity and scalability that traditional package design tools were never built to achieve.

Architecture Principles

Key Features

Supported File Formats

PackageCompiler supports a broad set of open, standardized design and layout formats.

FormatDirectionDescription
3DbloxInput3D system-in-package and multi-die assemblies
LEF/DEFInputIndustry-standard IC physical design exchange
VerilogInputStructural netlists for logical connectivity
BMapInput3Dblox columnar bump and ball map assignments
KiCadOutputOpen source PCB/package design exchange
GerberOutputManufacturing-ready fabrication data

Access Model

A public Beta version of PackageCompiler is currently available to friends of Zero ASIC. To get access, visit app.packagecompiler.com or contact our team to learn more.